Capabilities - Rigid Circuit Board >>Flexible Capabilities

ITEM mil mm
TRACES/SPACES
Minimum Trace Width/Space (Inner) 3.0/3.0 0.076/0.076
Minimum Trace Width/Space (External) 3.0/3.0 0.076/0.076
Minimum SMT Gap 3 0.075
Minimum BGA Pitch 14 0.35-0.40
DRILL
Minimum Drill Size For Through Hole (Mechanical Drill) 8 0.20
Minimum Drill Size For Through Hole (Laser Drill) 4 0.10
Aspect Ratio (Mechanical Drill) 10:1
PRE-PREG LAMINATE
Minimum Board Overall Thickness for 4 - Layer 10 0.254
6 - Layer 15 0.38
8 - Layer 19 0.48
10 - Layer 15 0.6
Minimum Thin Core Thickness 2 0.05
Maximum Overall Thickness for 2-18 Layer 250 6.35
Maximum Working Panel Size 25.2" x 24" 640 x 610
Maximum Layer Count 18 Layers
SOLDER MASK
Registration Tolerance: Layer to layer 3 0.075
Solder mask registration 2 0.051
CONTROLLED IMPEDANCE
Controlled Impedance 40-120Ω ± 10%
Diff. Controlled Impedance 75-120Ω ± 10%
SURFACE FINISH
Lead Solder (HASL) OSP (Entek)
Lead Free Solder (HASL) Carbon Ink
Immersion Tin (Chemical Tin) Peelable Mask
Immersion Silver Deep / Hard Gold
Immersion Gold (ENIG) Wirebondable Gold
MATERIAL OFFERING
FR-4 (150 C Tg) Shengyi, NP, Isola, KB
FR-4 (170 C Tg) Shengyi, NP, Ventec,Isola, Nelco
Aluminum Polyimide
Arlon Rogers 4350
E-Test UNIT PROCESS CAPABILITY
Flying Probe Tester / max 19.6" x 23.5"
Min Spacing From Test Pad to Board Edge mm 0.5
Min Conductive Resistance Ω 10
Max Insulation Resistance 100
Max Test Voltage V 500
Min Test Pad Diameter mil 3.9
Min Test Pad to Pad Spacing mil 3.9
Max Test Current mA 200

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